当今世界范围内常见倒装技术：

Flip Chip conductive method

1.Solder bump 锡凸块（solder）-C4 process(IBM)

2.Copper pillar bump铜柱加锡凸块(Copper pillar+Solder)-NCS process

3. Anisotropic conductive adhesives异性导电胶 –ACA（ACP）process

4.Polymer bump 高分子凸快 - C4 process

5.Stud bump. 打线成球 – US/TS /TC process

Remark：

C4: controlled collapse chip connection

ACF: Anisotropic conductive film

ACP(ACA): Anisotropic conductive adhesive paste

产品可靠性与成本的关系

技术发展趋势

Various flip chip technologies

Various flip chip process flow

1. SBB process:

2. C4: Controlled Collapse Chip Connection Process

3. ACP: Anisotropic Conductive Paste Process

4. ACF: Anisotropic Conductive Film Process